·浙江绍兴300mm集中电路中道先进封装生产线项目

Zhejiang Shaoxing 300mm centralized circuit middle channel advanced packaging production line project

·项目概况：瞄准集成电路晶圆级先进制造技术的应用，为芯片设计和制造提供晶圆级先进封装产品

Project overview: Aiming at the application of advanced wafer level manufacturing technology for integrated circuits, providing advanced wafer level packaging products for chip design and manufacturing

·建筑面积：176542.00㎡

Construction area: 176542.00 square meters

·总  投  资：80亿

Total: RMB 8 billion 

·产品/Products：抗震支架 seismic support